AC2150

High Level Features

  • TDM over Packet solution for 32xDS1/E1
  • CESoPSN and SAToP modes
  • Wander compliant to MEF18 and G.8261
  • Integrated DS1/E1 framer
  • Applications:
  • TDM over Packet
  • Wireless backhaul systems
  • Wireline network migration

Overview

The AC2150 TDM over Packet device implements Circuit Emulation Services Interworking Functions (CES IWF) for 32 DS1/E1 TDM channels.

The device integrates all functions for TDM transport applications in wireless backhaul systems: DS1/E1 framers, TDMoP IWF, and packet header processing.

The AC2150 implements the SAToP and CESoPSN modes defined by IETF, MEF, MFA and ITU. These support transport of transparent DS1/E1 channels, or provide bandwidth efficient nx64 fractional channels.

Each TDM channel can be configured independently for adaptive, differential or retiming clock recovery mode, and each channel may operate at a different clock rate.

The integrated DS1/E1 framers enable fault and performance monitoring, including test pattern insertion and loopback. The device supports Ethernet, VLAN, IP and MPLS PWE3 packet headers, and a dual Gigabit Ethernet interface.

The device is ideally prepared for new protocols or standards evolution due to its FPGA based design.

Evaluation systems are available for system level testing.

Features

  • TDM over Packet CES IWF for 32 DS1/E1 ports
  • SAToP or CESoPSN transport mode selectable per channel (RFC4553 and RFC5086)
  • Configurable amount of TDM data per packet
  • Clock recovery mode selectable per channel: adaptive, differential or retiming mode
  • RTP header for differential clock (RFC3550)
  • Jitter and wander compliant to MEF18, ITU-T G.8261 and G.823 / G.824 for traffic interfaces
  • Configurable jitter buffer size
  • Extensive set of CES fault and performance monitoring points
  • Integrated DS1/E1 framer with alarm, fault and performance monitoring, and support for loopbacks and PRBS maintenance functionality
  • Integrated packet header processor for MAC addresses, VLAN tags, IP and MPLS PWE3 headers

Interfaces

  • TDM interface to LIU at 1.544 or 2.048 Mb/s
  • Dual GbE SerDes or interface to external PHY
  • Clock: 19.44 MHz
  • DDR2 SDRAM buffer: 16 Mb x 16
  • 16-bit CPU interface

Technology and Package

  • 40 nm CMOS technology
  • 484-pin 23 x 23 mm FBPGA package
  • Typical power dissipation < 1.5 Watt

AC2150

Typical system applications for the AC2150 include:

  • TDMoP CPE and provider edge equipment
  • RBS or BTS base station network cards
  • Carrier Ethernet Switch or router blade for TDMoP network aggregation
  • TDM business access equipment for leased line migration
  • CMTS cable head-end
  • AMC I/O cards for ATCA and MicroTCA[/arrowlist]


A companion device, the AC2380 – OC12/STM4 TDMoP Gateway, targets TDM over Packet aggregation applications. The AC2150 and AC2380 are based on the same processing core and allow for seamless end-to-end interworking.

For more information about the specifications, please contact us.