High Level Features
OverviewThe AC2380 TDM over Packet Gateway device implements Circuit Emulation Services Interworking Functions (CES IWF) for a fully channelized OC-12/STM-4. Each of the 336 DS1 or 252 E1 channels embedded on the line interface are processed individually to provide a high-density Gateway between TDM over SONET/SDH and TDM over Packet.Each of the embedded DS1 or E1 channels may be asynchronously clocked on ingress and the reassembly function supports independent clock recovery for the TDM data towards the line interface. Each channel operates in either adaptive or differential clock recovery mode. The AC2380 implements the IETF and MEF8 defined SAToP and CESoPSN modes. These allow transport of either the full DS1/E1 channels, or bandwidth efficient fractional channels. Integrated SONET/SDH framers/mappers and DS1/E1 framers enable fault and performance monitoring, including test pattern insertion and loopback. The device supports Ethernet, VLAN, MPLS and IP/UDP PWE3 packet headers and a SPI-3 bus towards the packet network. The device is ideally prepared for new protocols or standards evolution due to its FPGA based design. Features
Interfaces
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TDMoP aggregation application
Typical system applications for the AC2380 include:
High density TDM over packet systems
Aggregation or gateway card on MSPP, Carrier Ethernet Switch or IP/MPLS Router
RNC or BSC controller network interface card
CMTS cable headend
AMC I/O cards for ATCA and MicroTCA

Device block diagram and interfaces
A companion device, the AC2150 - 32x DS1/E1 TDMoP, targets TDM CES line cards and CPE applications. The AC2380 and AC2150 are based on the same processing core and allow for seamless end-to-end interworking.